TechSDX FPGA-to-ASIC conversion service offers custom integrated circuit design of lower BOM cost, lower power consumption, higher integration for miniaturization, and long-term supply commitments, as well as a strategic response to FPGA End-of-Life (EOL) events. our solutions for leading Aerospace, Avionics, Defense, Industrial and Automotive companies and is a leading ASIC manufacturer of high-end embedded systems. Our custom solutions include IC chips requiring high-voltages, radiation tolerance, a focus on safety standards, and tolerance to harsh environments. Our fabless model ensures maximum flexibility in process selections allowing for optimized designs and cost-effective solutions. Our experienced teams are dedicated to our customers' success by working in collaboration with them throughout all stages of design and production.
Reliable, Proven Application Specific Integrated Circuit Development and Manufacturing
Full custom ASIC design flow
Full supplies services from specification to production
Custom Specific Standard Product − CSSP
System integration and packaging optimization
Benefits to Customers
IP investment protection
Board space optimization
Power optimization
Overall application cost reduction
Reliability improvement
Obsolescence management
Product differentiation from standard products
Experienced Team
System architects
Analog, digital, firmware, layout, packaging, test and product engineers
Program managers
Safety, Quality and Reliability
Safety critical applications: Automotive IS-26262, Avionics DO-254
Radiation Tolerance: TID, SEL/SEU, ELDRS, Prompt Dose, Neutron
High-Reliability, stringent-temperature -55C to 225C
Standards/Certifications/Classification: AS9100, ISO9001, MIL-PRF-38535, QML-Q, QML-V
Packaging Solutions
Flip Chip Multi-Layer Stack Up
Bump Die and WLCSP
Plastic Encapsulated
Multi Chip Module (MCM)
Hermetic High Reliability
Reliable, Proven Application Specific Integrated Circuit Development and Manufacturing
Full custom ASIC design flow Full supplies services from specification to production Custom Specific Standard Product − CSSP System integration and packaging optimizationBenefits to Customers
IP investment protection Board space optimization Power optimization Overall application cost reduction Reliability improvement Obsolescence management Product differentiation from standard productsExperienced Team
System architects Analog, digital, firmware, layout, packaging, test and product engineers Program managersSafety, Quality and Reliability
Safety critical applications: Automotive IS-26262, Avionics DO-254 Radiation Tolerance: TID, SEL/SEU, ELDRS, Prompt Dose, Neutron High-Reliability, stringent-temperature -55C to 225C Standards/Certifications/Classification: AS9100, ISO9001, MIL-PRF-38535, QML-Q, QML-VPackaging Solutions
Flip Chip Multi-Layer Stack Up Bump Die and WLCSP Plastic Encapsulated Multi Chip Module (MCM) Hermetic High Reliability